Packaging Material

Packaging Material Overview

Showa Denko Singapore Pte Ltd is the distributor in S.E.A. region for all products manufactured by Showa Denko Packaging.

All of our packaging products are made by aluminum foil, resin film or the composite of both – Aluminum Laminated Film (Almic-Can™)

We do provide customized solution on the “Printing”, “Laminating” and “Development” process of customer’s request. We are now able to present you following product range.

Overview Application Products Enquiry

Application

Easy peal cap seal for food packaging

Description:	Printed and laminated easy peel cap seals for yoghurt and chilled desserts such as pudding, jelly, and lactic acid bacteria beverages.
Application:	Milk Products, Yoghurt or any instant food/desserts
Benefits:	Excellent Seal Properties Excellent barrier to light / gas / water and aroma Very Easy Peel loved by customers Clear image and vivid color printing, high quality for brand positioning Cost reduction i.e. thinner Give a better solution compares to the current one e.g. free comparison analysis
Materials:	PET Aluminium Sealant/Hot melt

Products

Almic-Can™（Aluminum / Resin Composite Container)

Description:	Sealable, or non-sealed containers using the aluminium foil.
Application:	Dessert package with premium quality Freeze dried food Emergency rations
Benefits:	Excellent Seal Properties – Excellent barrier to light / gas / water Easy to Open– Loved by consumer Ease processing – Boil and retort sterilization

List of Almic-can size

Click image to enlarge

Hardpack

Description:	High-barrier package using aluminum foil on both sides of the PTP package.
Application:	Tablet (Food & Medicine) Electrical parts
Benefits:	Excellent Seal Properties Excellent barrier to light / gas / water Easy to open or tear– Loved by consumer

Aluminum Laminated Film SPALF™

Description:	Aluminum laminated film SPALF™ is a composite of aluminum foil and resin film, and it is used as the pouch for LIB.
Application:	LIB packaging for smart phone and tablet
Benefits:	Flexible for molding Excellent heat dissipation

Clean Bag for Silicon Wafer

Description:	Please send us your inquiry
Application:	Please send us your inquiry
Benefits:	Please send us your inquiry

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