EMC NH-860

Product Series - Electronics

EMC NH-860 Overview

Showa Denko is one of the top providers of Epoxy Molding Compound (EMC) for semiconductor industry, with more than 30 years’ experience. In Malaysia, we have 2 manufacturing sites and 1 R&D facility to support our local as well as world-wide customers.

With the growing Automotive industry, semiconductor packaging has become increasingly challenging with requirement to meet AEC-Q100 Grade0 MSL1 standard and beyond. Showa Denko is developing new EMC to meet this challenge – NH-860 series. It is designed with low modulus and high adhesion strength to prevent delamination, and thus improving package erliability. NH-860 series meets good MSL and package reability performance with non-roughened QFN package.

In addition, NH-860 series enables semiconductor package leadframe to switch from roughened to non-roughened surface. Thus, it has good potential for overall package cost down.

Join us in this journey towards AEC-Q100 and beyond.

Performance

Showa Denko is developing new Epoxy Molding Compound (EMC) the NH-860 series that can meet AEC-Q100 Grade0 MSL1 standard and beyond. It is designed with low modulus and high adhesion to improve reliability and prevent delamination. 

Through internal evaluation, NH-860K2 can meet good MSL performance for QFN and SOP packages as shown in table below.

 

Note: all leadframes are non-roughened.
Note: NH-860K2 is improvement from NH-860 which is the initial development item.

By using NH-860K2, it enables package cost reduction by changing leadframe (or lead-frame) from roughened to non-roughened surface.

NH-860 has low modulus and high adhesion properties to prevent delamination.

PropertiesUnitMass Production EMC1NH-860K2
Tg°C102100
Specific Gravity2.001.99
CTE, α1ppm/°C109
CTE, α2ppm/°C3134
Flexural Modulus (Room Temp.)GN/m22827
Flexural Modulus (260°C)MN/m2530290
Ag adhesion (Room Temp.)MPa7.98.4

Ag adhesion (260°C with soaking)

MPa0.40.3
PDF adhesion (Room Temp.)MPa6.28.9
PDF adhesion (260°C with soaking)MPa0.10.4

Refer to table above, NH-860K2 has lower modulus and higher adhesion strength to prevent delamination.

NH-860K2 Passed MSL1 with Zero Delamination


Non-roughened PPF QFN package


Non-roughened ring-AgCu QFN package

PKG size      : 10 x 10mm
Die pad size : 6.4 x 6.4mm
Die size        : 3 x 3 x 0.37mm

NH-860K2 Passed Continuous Molding 600 Shots


Achieve CTI 600V based on internal evaluation (based on IEC60112)

CTI Test

Drop Volume0.997 – 1.147g for 50 drops
Drop height35 ± 5mm
ElectrolyteAmmonium chloride solution (0.1±0.02%)
Drop interval30±5s
Short-circuit criterion>0.5A for 2s
EMC Thickness3mm

Insulating Material
Group

CTI

 

I600 ≤ CTI NH-860K2 ⭐
II400 ≤ CTI < 600 
IIIa175 ≤ CTI < 400 (FR4) 
IIIb100 ≤ CTI < 175 

 

Achieve AEC-Q100 Grade 0 Requirement

(1)  NH-860K2 pass TC 2000 cycles (-55°C to 150°C) on non-roughened PPF SO-28L leadframe.

(2)  NH-860K2 pass HTSL 2000 hours (175°C) on non-roughened PPF SO-28L leadframe.

(3)  NH-860K2 pass b-HAST 192 hours (130°C/85%RH/5V) on non-roughened PPF SO-28L leadframe.

Datasheet

For more information, kindly refer to Datasheet below.

Kindly click the following links below to start your download.

NH-860K2 properties

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