Showa Denko is one of the top providers of Epoxy Molding Compound (EMC) for semiconductor industry, with more than 30 years’ experience. In Malaysia, we have 2 manufacturing sites and 1 R&D facility to support our local as well as world-wide customers.
With the growing Automotive industry, semiconductor packaging has become increasingly challenging with requirement to meet AEC-Q100 Grade0 MSL1 standard and beyond. Showa Denko is developing new EMC to meet this challenge – NH-860 series. It is designed with low modulus and high adhesion strength to prevent delamination, and thus improving package erliability. NH-860 series meets good MSL and package reability performance with non-roughened QFN package.
In addition, NH-860 series enables semiconductor package leadframe to switch from roughened to non-roughened surface. Thus, it has good potential for overall package cost down.
Join us in this journey towards AEC-Q100 and beyond.
