|Tag:||molecular sieve Semiconductor toxic gas|
Semiconductors such as smartphones and laptops support our convenient lives with their functions.
This time, I would like to introduce the Showa Denko Group's technology that helps semiconductor manufacturing.
Using a large amount of harmful gas? And looking to remove it?
The semiconductor manufacturing process typically goes through the following processes.
In this process, special gases are used in the Etching, Cleaning, and Deposition processes.
This gas contains toxic components such as (CF4, CHF3,ClF2, F2, Cl2, HF etc) and must be properly treated at the work site after use.
Thus, the following removal devices are installed at each site.
The removal device is filled with adsorbents such as activated carbon and molecular sieves, and by passing through these adsorbents, harmful components such as chlorine ions and fluorine ions are removed. Such equipment is indispensable to maintain a safe working environment.
So why do customers choose Showa Denko's Molecular Sieves among many other manufacturers?
This is because:
・The binder ratio in the molecular sieve is lowered to maximize the adsorption efficiency.
For these reasons, our semiconductor industry customers have been patronizing our molecular sieves for many years.
“I need to improve the performance of the treatment device”
“I want to purchase reasonably price Molecular Sieve”
If you are in the semiconductor industry with such needs, do not hesitate to contact Showa Denko when selecting adsorbent materials.
Utilizing the experience of the world's top share, we will provide the solution that suits your work site.
Click the button below to submit your inquiry ↓